Micro Porous Ceramic Heat Sinks provide a very large surface area compared to conventional Copper and Aluminium Heat Sinks.
Heat is moved by air circulation , without external force, through the embedded radiation micro porous ceramic material.
This way the accompanying IC components can operate continuously in a given temperature environment.
The material also provides low thermal capacity in unit volume compared to Copper and Aluminium Heat Sinks.
The heat sink dissipates heat faster than metal Heat Sinks without storing heat within itself.
Easy to fix, they are supplied with thermally conductive adhesive tape with pull tab for direct surface IC contact
Non-electrical conductive, non antennae effect, humidity and dust proof with with a long life span.
Size:20*20*2.5mm
Material quality : Ceramic
Application:Power IC
Color:Gray
Feature
- Big air-contact area, good heat spreader
- Low weight
- High Voltage Breakdown / High Resistance
- Easy to assemble
- The special shape can be ordered
Application
- Power Module、CPU、Chip IC、PC Board